- Forms a long-lasting, strong bond
- No priming required for most substrates
- With Flextec® technology: water- and solvent-free, excellent workability, easy removal of stains
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Forms a long-lasting, strong bond
-
No priming required for most substrates
-
With Flextec® technology: water- and solvent-free, excellent workability, easy removal of stains
CERESIT® P 675 is a very low-emission, single-component special adhesive for bonding oak strip wood flooring and engineered wood flooring. The product can be applied on mineral screeds, dry screed constructions, chipboards, OSB boards and levelling compounds. Available bucket size: 16 kg
The substrates must be clean, free from structural defects, firm, dry and free of substances which may impair adhesion.
Stir the adhesive well and apply it evenly to the substrate with a suitable notched trowel. Only apply as much adhesive as can be laid with wood flooring within the working time. Ensure the backing of the wood flooring is well wetted. Avoid gluing the edges.
Allow a minimum gap of 10 mm from walls. Remove the spacer wedges from the perimeter joints immediately- after installation. Avoid walking on the parquet surface both during and for at least 24 hours after installation.
CERESIT P 675 can be used on: wood flooring, mineral screeds, dry screed constructions, chipboards (V100) and OSB boards, natural stones, tiles and terrazzo.
The adhesive is water- and solvent-free, provides excellent workability, stains can be removed easily, and the product is permanently elastic.
Carry out floor installation work at floor temperatures above 15 °C, air temperature above 18 °C and the relative humidity below 75 %.